December 5 - 7, 2017
Marriott San Francisco Airport
Tuesday, December 5, 2017
San Francisco, CA, USA
Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer Handling in an invited talk at 3D ASIP:
Tuesday, December 5, 2017
SESSION 3 Equipment & Materials
5:00pm-5:20pm
Check out the program agenda here.
3D ASIP has been recognized as the premier conference on 2.5 / 3DIC focused on commercialization and infrastructure. This year’s program is expanding to cover all high-density 3D packaging solutions, continuing the tradition of offering cutting-edge presentations from scientists, technologists and business leaders from across the globe.
3D ASIP is organized by
IMAPS – International Microelectronics Assembly and Packaging Society – www.imaps.org
Schedule a time to meet at the conference or ask a question about a featured product:
