Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
詳細を見るBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
詳細を見るWith over 40 years of experience in semiconductor application testing and analysis, our engineers have refined experience handling wafer sizes ranging from 100 mm to 300 mm.
This expertise, combined with our state-of-the-art temporary bonding and debonding materials, enables us to provide you with small-scale, feasibility-level temporary bonding and debonding process and analysis services.
Contact Us to Discuss Your Bonding Needs
*Process tailored to the specific need.
Temporary Bonding / Debonding Services