Brewer Science presents high-temperature stable temporary bonding materials at EPTC in Singapore
High-temperature-stable temporary bonding materials enable IR laser debonding
Singapore – November 25, 2024 – Brewer Science, Inc., an industry leader in advanced packaging materials for semiconductor manufacturing, will present its latest research developing the next-generation of 3D packaging materials and thin-wafer processing techniques, at the Electronics and Packaging Technology Conference in Singapore, December 3rd through 6th.
Temperature Limitations in Temporary Bonding Materials are Limiting Processing Capabilities
Brewer Science collaborates with EV Group (EVG) and AMS-Osram to address temporary bonding material challenges, such as chemical vapor deposition (CVD) or other high-temperature processing steps, that are currently limited by debonding temperatures of 250°C. The team co-presents a high-temperature-stable temporary bonding material, BrewerBOND® C1301-50 material, that is able to withstand temperatures up to 420°C, making it compatible with EVG’s IR LayerRelease™ laser debonding technology to expand processing capabilities, integrating high-temperature processes without compromising the device during backside processing. Attend Brewer Science and EVG’s joint presentation High-temperature-stable temporary bond adhesive for IR laser debonding enables new process integration for thin wafers on December 6, 2024 at 10:35 am in Veranda II to answer some of our industry’s most pressing questions on this topic, including:
- How can temporary bonding materials be improved to withstand high-temperature processes?
- Can IR laser debonding successfully work with silicon-based carrier systems?
- How does this development impact CMOS devices?
For those unable to attend the event, additional information can be obtained by submitting a request at the bottom of our website.
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.
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Company Contact:
Nathan Ayres
Tel: (US) +1.573.364.0444, ext. 1923
Email: nayres@brewerscience.com
