Innovation in hybrid bonding and laser debonding presented at EPTC in Singapore
3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science
Singapore – December 2, 2024 – Brewer Science, Inc., an industry leader in advanced packaging materials for semiconductor manufacturing, will present its latest research developing the next-generation of 3D packaging materials and thin-wafer processing techniques, the Electronics and Packaging Technology Conference in Singapore, December 3rd through 6th.
High Cost and Stringent Requirements are Preventing Cu/SiOx Scalability
Brewer Science collaborates with Industrial Technology Research Institute (ITRI) to address the challenges associated with scaling hybrid bonding in advanced packaging: cost, temperature and defectivity. The team co-presents a photosensitive polymer material that serves as an organic passivation layer, potentially mitigating challenges that pose the greatest threat to scaling what is currently a copper (Cu) and silicon oxide (SiOx) hybrid bonding process. Attend Brewer Science and ITRI’s joint presentation, Versatile Photosensitive Polymer Applied in Low-Temperature Hybrid Bonding with Nanocrystalline Cu on December 6, 2024. at 9 am in Veranda III to answer some of our industry’s most pressing questions on this topic, including:
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- How can the cleanliness requirements of current Cu/SiOx hybrid bonding processes be reduced?
- How can the bonding process be made more accessible to backend fabs, such as OSATs?
- Is there an alternative to the high-temperature annealing typically required in hybrid bonding?
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Temperature Limitations in Temporary Bonding Materials are Limiting Processing Capabilities
Brewer Science collaborates with EV Group (EVG) and AMS-Osram to address temporary bonding material challenges, such as chemical vapor deposition (CVD) or other high temperature processing steps, that are currently limited by debonding temperatures of 250°C. The team co-presents a high-temperature stable temporary bonding material, BrewerBOND® C1301-50 material, that is able to withstand temperatures up to 420°C, making it compatible with IR LayerRelease™ laser debonding technology (provided by EVG) to expand processing capabilities, integrating high-temperature processes without compromising the device during backside processing. Attend Brewer Science and EVG’s joint presentation High-temperature-stable temporary bond adhesive for IR laser debonding enables new process integration for thin wafers on December 6, 2024 at 10:35 am in Veranda II to answer some of our industry’s most pressing questions on this topic, including:
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- How temporary bonding materials can be improved to withstand high temperature processes?
- Can IR laser debonding successfully work with silicon-based carrier systems?
- How does this development impact CMOS devices?
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“Our research into high-temperature-stable temporary bonding materials and IR laser debonding technology represents a significant leap forward for the advanced packaging industry. By enabling reliable bonding and debonding at temperatures up to 420°C, we’re opening the door to more complex process integrations and expanding the capabilities of silicon-based carrier systems,” states Matt Koch, Business Development Manager at Brewer Science. “This development will help fabs overcome existing temperature limitations and meet the growing demands of high-performance device manufacturing.”
For those unable to attend the event, additional information can be obtained by submitting a request at the bottom of our website.
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.
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Company Contact:
Nathan Ayres
Tel: (US) +1.573.364.0444, ext. 1923
Email: nayres@brewerscience.com
