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Dougal Guerrero, Ph.D. will present "Merging of Material, Process and Machine Towards Sustainable Manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Event Read MoreMarch 14-16, 2018 Shanghai New International Expo Centre Shanghai, China Booth #: Brewer Science Booth: #2635 Nissan Chemical Booth: #2531 Description: SEMICON China is one of the fastest growing SEMI…
Read MoreMarch 13-15, 2018 Messe München Munich, Germany Booth #: 303 Description: For the second year in a row, Brewer Science will be exhibiting at LOPEC – International Exhibition and Conference…
Read MoreMarch 11-12, 2018 Shanghai New International Expo Centre Shanghai, China Description: Brewer Science will be presenting at this annual semiconductor technology conference in Shanghai. This is the biggest technology conference…
Read MoreFebruary 25 – March 2, 2018 Booth #: 110 San Jose Convention Center San Jose, California Speaker Information: Presenter: Zhimin Zhu Time: Tuesday, February 27th: 10:30AM – 12:10PM Optical Microlithography…
Read MoreFebruary 12-15, 2018 Hyatt Regency Monterey, California Description: Flex 2018, a SEMI organization event in collaboration with MEMS & Sensors Technical Congress (MSTC) in Monterey, California, will be the…
Read MoreJanuary 28-31, 2018 Messe Munchen Munich, Germany Description: ISPO is the world’s leading sports business trade fair. Gathering the major brands, suppliers, and innovators for sports technology into one area…
Read MoreDecember 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information:…
Read MoreDecember 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes…
Read MoreTuesday, December 5, 2017 San Francisco, CA, USA Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer…
Read MoreOctober 29-November 2, 2017 Tampa, FL Don’t miss our presentation Materials and Methods for Bottom-Up Semiconductor Device Manufacturing by Selective Surface Modification, Reuben Chacko, J. Lowes, J. Dai, S. Brown,…
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