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Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025 Enabling 3D integration requires strategic temporary bonding material selection Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, will present innovations in temporary bonding materials at two premier conferences this…
Event Read MoreOctober 11-13, 2016 Leti Grenoble, France http://www.dsasymposium.org/index.php/homepage/venue This symposium on directed self-assembly (DSA) will be held in Grenoble, France and will include presentations and exhibits featuring materials, processing, DSA-friendly design,…
Read MoreSeptember 28th, 2016 Fayetteville, Arkansas
Read MoreSeptember 27th, 2016 Rolla, Missouri
Read MoreSeptember 20-21, 2016 Computer History Museum Mountain View, California http://www.semi.org/en/node/41386 The theme for this year’s Strategic Materials Conference (SMC) is Scaling Challenges: The Future of Materials and Packaging. What is…
Read MoreAugust 21-25, 2016 Philadelphia, Pennsylvania
Read MoreJuly 12-14, 2016 Moscone Center San Francisco, California SEMICON West is an annual event built around keeping up with the latest disruptive trends driving today’s market. This event brings…
Read MoreJune 12-15, 2016 Salt Lake City, Utah
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