Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
詳細を見るBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025…
Event Read MoreVichy, Missouri - August 15, 2023 - Brewer Science, a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, is thrilled to announce the expansion…
Read MoreNovember 6, 2023 – Springfield, MO - Brewer Science, in cooperation with the Springfield Regional Arts Council, hosted an exhibit featuring original art and photography during October. “Pure Enjoyment” featured…
Read MoreBrewer Science presents innovative materials and processes at SPIE Advanced Lithography Conference 2024 San Jose, CA – February 21, 2024 – Brewer Science, Inc., a global leader in developing…
Read MoreBrewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing San Jose, California – October…
Read MoreBrewer Science Advances Midwest Semiconductor Growth at SEMIEXPO Heartland 2025 Dr. Terry Brewer Named Honorary Chairman as SEMIEXPO Heartland Focuses on Smart Manufacturing, Mobility, and Workforce Development Indianapolis, IN…
Read MoreMarch 31, 2025
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