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Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025 Enabling 3D integration requires strategic temporary bonding material selection Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, will present innovations in temporary bonding materials at two premier conferences this…
Event Read MoreNextFlex Innovation Days – March 26 – March 27 Brewer Science will be exhibiting at NextFlex Innovation Days in Santa Clara, California. Dr. Terry Brewer will give a keynote presentation.…
Read MoreBrewer Science Showcases Water Quality Sensor Innovations at NextFlex Innovation Days 2025 Dr. Brewer’s Keynote Address Challenges the Industry to Rethink the Future of Hybrid Electronics Santa Clara, California…
Read MoreIntegration Engineering and Novel Underlayers Presented at SPIE Advanced Lithography + Patterning 2025 Keynote presentation addresses architecture and design impacts on lithography scaling challenges San Jose, California – February…
Read MoreSPIE AR VR MR 2025 Materials for next-generation optical devices with high transmission presented by Reuben Chacko Event: SPIE AR VR MR 2025 Location: San Francisco, California Conference Center:…
Read MoreHybrid Bonding Symposium hosted by IEEE Materials for Hybrid Bonding presented by Andrea Chacko Event: Hybrid Bonding Symposium hosted by IEEE Location: Silicon Valley, California Conference Center: SEMI World…
Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Read MoreBrewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification San Diego, CA – October 23, 2024 – Brewer Science, Inc., a…
Read MoreMaterials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024 Experience higher integration density and improved performance through hybrid bonding techniques. Boston, MA – September 24, 2024 –…
Read MoreBrewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing. Taipei, Taiwan –…
Read MoreSUBMIT YOUR ARTWORK Please submit your artwork before August 23rd, 2024. Loading ... 2024 Schedule: July 1st - August 23rd (midnight): Submit Entries Online September 7th: Notification of…
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