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Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025…
Event Read MoreBrewer Science Showcases Water Quality Sensor Innovations at NextFlex Innovation Days 2025 Dr. Brewer’s Keynote Address Challenges the Industry to Rethink the Future of Hybrid Electronics Santa Clara, California…
Read MoreIntegration Engineering and Novel Underlayers Presented at SPIE Advanced Lithography + Patterning 2025 Keynote presentation addresses architecture and design impacts on lithography scaling challenges San Jose, California – February…
Read MoreSPIE AR VR MR 2025 Materials for next-generation optical devices with high transmission presented by Reuben Chacko Event: SPIE AR VR MR 2025 Location: San Francisco, California Conference Center:…
Read MoreHybrid Bonding Symposium hosted by IEEE Materials for Hybrid Bonding presented by Andrea Chacko Event: Hybrid Bonding Symposium hosted by IEEE Location: Silicon Valley, California Conference Center: SEMI World…
Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Read MoreBrewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification San Diego, CA – October 23, 2024 – Brewer Science, Inc., a…
Read MoreMaterials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024 Experience higher integration density and improved performance through hybrid bonding techniques. Boston, MA – September 24, 2024 –…
Read MoreBrewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing. Taipei, Taiwan –…
Read MoreSUBMIT YOUR ARTWORK Please submit your artwork before August 23rd, 2024. Loading ... 2024 Schedule: July 1st - August 23rd (midnight): Submit Entries Online September 7th: Notification of…
Read MoreImplementation of New Materials and Printed Electronics for Monitoring the Environment Brewer Science, a pioneer in printed electronics and smart device technology, invites all attendees of ‘The Future of Electronics…
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