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Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference Austin, TX– April 7, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025…
Event Read MoreAdam Scotch will present Printed Electronics for Air and Water Quality Monitoring at the Electronics Reshaped conference hosted by TechBlick in Berlin, Germany and Virtually. More information about the event…
Read MoreBrewer Science will be co-presenting a joint paper with imec, and co-presenting another joint paper with VeeCo at the 56th International Symposium on Microelectronics, IMAPS Symposium 2023. Please join us…
Read MorePlease join us at 2023 SEMICON TAIWAN September 6th - 8th. We will be exhibiting at booth K2470 at TaiNEX 1&2 in Taipei, Taiwan. For more information about SEMICON Taiwan,…
Read MoreBrewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023 Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023…
Read MoreYour Go-To Resource For All Things Manufacturing! Missouri Enterprise is partnering with Brewer Science to offer a No-Cost “Lean 101” Workshop, that introduces you to Lean Manufacturing concepts. This workshop…
Read MoreBrewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference Cost-efficient and robust screen-printed sensors are the future of CO2 sensing Cancun, Mexico– July 13, 2023 –Brewer…
Read MoreJiadeng Zhu presents Printed and Flexible CO2 Sensors Prepared via Different Carbon Materials: A Comparison Study at The World Conference of Carbon 2023 at Cancun, Mexico on July 16 -…
Read MoreAdam Scotch will be presenting, "Arrays for On-Demand Water Quality Monitoring" at the virtual TechBlick event on June 22nd, at 18:13 Berlin Time. Register for the free virtual event on…
Read MorePlease join us at 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) May 30th through June 2nd. Brewer Science will present Process Challenges during CVD Oxide Deposition on the…
Read MoreImec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC) Process challenges during CVD oxide deposition on the…
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