Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
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Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025 Enabling 3D integration requires strategic temporary bonding material selection Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, will present innovations in temporary bonding materials at two premier conferences this…
Event Read MoreThe 2022 International Conference on Flexible and Printed Electronics (ICFPE2022), to be held October 11 to 14, 2022 at Shinhwa World in Jeju Island, Korea. ICFPE 2022 will underpin the…
Read MoreBrewer Science Celebrates National Manufacturing Day by Hosting an Open House and Providing Facility Tours on October 7th Global supplier to the semiconductor industry invites the community to witness world-class…
Read MoreThe International Microelectronics Assembly and Packaging Society (IMAPS) 2022 Conference brings together industry leaders with a mission to engage our workforce community to identify solutions, which address US Government and…
Read MoreBrewer Science presents EUV lithography innovation at Fujifilm Advanced Lithography Workshop in Germany Brewer Science will be presenting at the Fujifilm Advanced Lithography Workshop in Desden, Germany on 15 September…
Read MoreCome visit Brewer Science's booth (J2242) at SEMICON Taiwan, September 14 - 16, 2022 SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also…
Read MoreBrewer Science is exhibiting at the Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics The Largest Online Gathering of the Printed Electronics Community Visit Brewer Science Virtual Booth 24 June |…
Read MoreMatthew Beard, Director of Integrated Management Systems at Brewer Science, shares his expert insight creating sustainability strategies and implementing environmental programs in the semiconductor industry. Join us for this…
Read MoreDouglas Guerrero will be presenting Roles of Underlayers in Novel Patterning for EUV Lithography, and Zhimin Zhu will be presenting Suppressing Stochastic Interaction to Improve EUV Lithography at CSTIC, one…
Read MoreThe Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment…
Read MoreBrewer Science will be exhibiting at the SMC (Strategic Materials Conference) Korea 2022. Check out our virtual booth to learn more about our innovative approach to EUV lithography. Yichen Liang…
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