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Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025 Enabling 3D integration requires strategic temporary bonding material selection Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, will present innovations in temporary bonding materials at two premier conferences this…
Event Read MoreShelly Fowler will be presenting, A Novel Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications at CS Mantech. She will be apart of session 12: Integrations & Packaging…
Read MoreRama Puligadda will be presenting New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging at the CMC Conference. Brewer Science is a "Coffee Break Sponsor" at this…
Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Jakub Kosa will be presenting, High-temperature stable spin-on carbon…
Read MoreAdam Scotch, Director of R&D in Smart Devices and Printed Electronics Foundry presented, "Deploying Printed Electronics for Water Quality Measurements" at the TechBlick Virtual Exhibition, the largest online gathering of…
Read MoreWhite at SEMICON West, Rama Puligadda, Kim Arnold, and Alex Smith sat down with Francoise von Trapp with 3D Incites to talk on her podcast about the company’s growth, its…
Read MoreBrewer Science is hosting a virtual Manufacturing Day featuring local Missouri manufacturers through videos and a live Q&A discussion. This free event is open to students, job seekers,…
Read MoreJonathan Jeauneau and Douglas Guerrero will be presenting research at the 20th annual FujiFilm Advanced Lithography Workshop Hybrid Event. Join us to explore the latest innovations in the semiconductor industry.…
Read MoreDan Brewer will be presenting, "Driving Global Technology Advancements from Missouri" : Aug 19th at 1:10pmCT. Missouri is projected to be a top state for tech job growth in the…
Read Morehttps://youtu.be/YHo6LFOmYyg Rolla, Mo. August 3, 2021 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will be…
Read MoreThe 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly…
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