PermaSOL® materials address a range of needs identified for permanent bonding applications, which include low-temperature bonding, excellent chemical resistance, thermally curable bonding process and no material movement after the bonding process.
Permanent bonding materials are adhesives used to assemble IC logic chips, memory chips, image sensor devices, and microelectromechanical systems (MEMS) devices that go into high-density heterogeneously integrated packages. These high-density, ultra-thin electronic packages are needed for artificial intelligence (AI) in high-performance computers, data centers, 5G, and high-end mobile products.
Permanent Bonding Materials
