Brewer Science offers a complete line of analytical and application testing services, specializing in semiconductor and other high-technology products, through materials characterization and contaminant reduction.
With over 40 years of experience in chemical analysis and semiconductor application testing, put Brewer Science's experience and world-class equipment to work.
State-of-the-art instruments, combined with our analysts' knowledge, experience, and skills, enables our advanced material characterization capabilities. We can not only measure the purity of materials, but report on the impurities with a part-per-trillion ion detection capability.
| Small Molecule Analysis (purity determination, impurity identification, structure, quantification, general profile) | – HPLC – GC-FID – HC-GC-FID – GC-MS | – UV-Vis – LC-MS – FTIR – IC |
| Polymer Analysis (accurate MW/PDI, polymer conformation, oligomer investigation) | – GPC-MALS – GPC-RI/UV – DLS | – Fraction GPC – LC-MS |
| Thermal Analysis (thermal properties, mechanical properties) | – DSC – TGA – Viscometer – TDU-GC-MS – TMA | – DMA – Rheometer – TGA-GC-MS – Pyrolysis-GC-MS |
| Trace Metal Analysis | – LC-ICP-MS | – QQQ-ICP-MS |
| Particle Analysis | – DLS | – SP-ICP-MS |
| Other | – pH – RapidVap | – Contact Angle – VeeMax-FTIR |
| 300-mm Si Wafer Testing | – Inspection: bare Si ≥20-nm detection limit – Defect inspection tailored to customer requirements – Inorganic & organic thin films up to 500-nm thick – Defect review: SEM imaging and EDS – Plasma etch rates with multiple gases and endpoint detection |
| SEM | – Cross-section – Focused Ion Beam (FIB) – EDS Capability |
| AFM | – Surface Roughness – Hardness/Indentation |
| Polymer Film Thickness (coated samples / bonded pairs with interferometer / reflectometer) | – Thickness Average – Thickness Range (TTV) – Thickness Standard Deviation – IR Capability to Measure Through Si |
| Total Sample Thickness (wafers / panels / bonded pairs between dual optical-distance sensors) | – Thickness Average – Thickness Range (TTV) – Thickness Standard Deviation – Warp – Bow – Stress (2-step measurement) |
| Bond Line Quality Analysis (bonded pairs with CSAM) | – Void Identification |
| Surface Inspection / Measurements (select regions with high-mag laser microscope) | – Surface Feature / Defect Imaging – Dimensional and Height Measurements |
Brewer Science Testing Services
