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Multi-layer: A better solution in manufacturing

When faced with a difficult problem, it’s hard to know which way to go. Technology and semiconductor manufacturing certainly have their fair share of challenges. The biggest one (or at least the most recurring) is that demand for smaller and smaller feature sizes is greater than our ability to manufacture them. There’s always the quick…

  Lithography, spin on carbon, planarized substrates, hardmask, multi-layer Click Here to Read More
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