Brewer Science

Newsroom

Show Me All News Blog Ebooks Videos Press Releases Events

Related Articles

Temporary Bonding and the Importance of Thermal Stability

Noted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress. . . ." From the invention of the first integrated circuit in 1958, technology has evolved at an unbelievable rate, and, as Kurzweil suggests, that won't…

  Ray Kurzweil, Thermal Stability, Wafer-Level packaging, Temporary Bonding Click Here to Read More
Top
Powered by Translations.com GlobalLink Web Software