Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
詳細を見るBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
詳細を見るShow Me | All News | Blog | Ebooks | Videos | Press Releases | Events |
---|
As we push to shrink feature sizes and introduce full-scale 3D integration, the substrates on which integrated circuits are printed must obviously become thinner. Much thinner. While shaving down the substrates to less than 100 micrometers thick is a readily available process, moving to even thinner device substrates (<50 µm) makes for an extremely fragile…
Click Here to Read More