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Anyone who has worked in a fancy restaurant can tell you that the small details make the biggest impact. The food has to be perfect, yes. But even a simple thing such as the way the napkins are folded or how often your water is refilled can make a lasting impression on the patrons. Oftentimes,…
Click Here to Read MoreRolla, Missouri – Sept. 3, 2018 – Brewer Science, Inc. today, from SEMICON Taiwan 2018, introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging…
Click Here to Read MorePresentation Friday, June 3rd · 2:20PM Session 36: 3D materials & Processing Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material" Alain Phommahaxay, Goedele Potoms, Greet Verbinnen, Erik Sleeckx, Gerald Beyer, and Eric Beyne – IMEC; Alice Guerrero, Dongshun Bai, Xiao Liu, Kim Yess, and Kim Arnold – Brewer…
Click Here to Read MoreContinuing our multi-year tradition, Brewer Science is joining hundreds of other worldwide exhibitors in showcasing our latest technologies Dec. 16–18 at the 38th SEMICON Japan, the largest annual gathering for the semiconductor manufacturing industry. This year we highlight our BrewerBOND® materials, temporary bonding equipment suite, and ARC® materials at the Tokyo International Exhibition Center event,…
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